Fast Prototyping & Manufacturing of Smaller, Lighter, and More Reliable Flex Circuits
Our technical teams can produce your standard flex prototype in 5 days and developmental flex prototype in 15 days. Challenge us with multilayer, sub 2-mil thickness, tight registration, and a high number of traces. Give us your toughest HDI with a specific RF performance requirement. Ask us to make your flex circuits smaller, lighter, and more reliable.
Our flex circuit capabilities can meet rigorous requirements, like these:
- 1 mil (25 μm) trace/space
- 25 μm vias and critical dimensions of laser ablated features to 10 μm
- Complex 3+ layer HDI flex circuits that other shops won't touch
Why flex circuits?
Thickness & Package Size
Because flexible circuits use the thinnest dielectric substrates available for making electronic interconnections, it’s possible to produce flex circuits with a total thickness approaching 1 mil (25 μm), including a protective cover layer. A thin profile allows tighter spacing, thin traces, and in many cases, layer reduction.
Smaller circuits are naturally lighter. Some applications result in a weight reduction of 50% or more over rigid or rigid-flex designs. Our dielectric material sets are thin in dimensional thickness and use lighter “copper weights,” resulting in a lightweight, highly flexible circuit construction.
Reduction in Assembly Time, Errors, and Cost
Flex circuits can reduce product assembly time because they seamlessly integrate form, fit, and function into a single circuit. A reduction in assembly time also reduces manufacturing errors and costs.
Understanding Flex Circuits
Flex circuits are used in cars, computers and peripherals, digital cameras, and exercise machines. They’re found in industrial lasers, inductor coils, and heater coils. Medical uses include everything from hearing aids to ultrasound equipment to defibrillators. You’ll find flex circuits in NMR analyzers, x-ray machines, particle counters, and infrared analyzers. Flex circuits reduce production costs and enable devices like smartphones, instrument panels, plasma displays, and smart weapons to be lighter, highly flexible, and smaller, with fewer in-field reliability issues.
A single layer flex circuit features a single conductive circuit layer with top or bottom access to the conductors. Stiffeners and connectors are optional.
A double layer flex circuit has two conductive layers with insulating dielectric in between. Plated through-holes (vias) provide connectivity between layers, and there’s top or bottom access to the conductors. Stiffeners and connectors are optional. Read more about our laser micromachining and drilling capabilities that can create blind vias down to 1 mil.
A multilayer flex circuit has three or more conductive layers with insulating dielectric in between. It features blind or buried vias and top or bottom access to conductors. (A blind via extends to one surface only of a flex circuit; a buried via does not extend to either surface.)
We specialize in microvias—vias created with precision laser drilling techniques and that require dimensional and positional accuracy, which most firms cannot attain.